Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD
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Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD

Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD

Select Cutting Size
From $1,698.00
Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD—
$1,698.00

The Story

SPECIFICATIONS
Features
  • Diamond Scriber for cutting the thin single crystal substrate such as Silicon, Sapphire, Ge, LiNbO3, and LiTaO3 Wafer
  • The cutting pressure is adjustable by the spring
  • Cutting size:   
    • 100 x100 mm (4 x 4")
    • 200 x200 mm (8 x 8'')
    • 300 x300 mm (12 x 12'')
    • Max. The cutting thickness for single-crystal substrate: 1 mm
  • Made in Japan
Cutting Procedure
  • Adjust the height of the diamond scriber
  • Tuning the pressure of the spring
  • Placing the substrate
  • Scribing
  • Splitting the substrate
Replace Diamond Scriber
  • Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the original point of 0
  • Move the slide unit to the diamond scriber replacement position and remove the guide rod
  • Turn the handle over 90 degrees to the left
  • Loosen the screw by using the hex wrench and remove the diamond scriber
  • Install the new diamond scriber and tighten the screw
  • Return the handle to the scribing position and set the guide rod
Product Dimensions
  •  SYJ-DS100: 210 mm (L) x 210 mm (W) x 140 mm (H)  
  •     SYJ-DS200: 310 mm (L) x 310 mm (W) x 140 mm (H)
  •     SYJ-DS300: 410 mm (L) x 410 mm (W) x 140 mm (H)
Diamond cutting knife
  • One diamond knife is included with a dimension 13 mm (L) x 26 mm (W) x 5 mm (H)
  • Please click the picture let to order a replacement
The thickness of the Cutting Wheel
  • 0.65mm
Compliance
  • No UL is required because no electric
Warranty
  • One-year limited warranty with lifetime support
Operational video
  •   
Application Notes
  • The minimum size of the substrate is at least twice the thickness. Generally, it is 5 mm x 5 mm.
  • Replace the diamond scriber when dull
  • To avoid the spring being degraded, turn the spring pressure dial to the initial position of 0 after use
  • For long-term use, wipe the slitting unit guide rod periodically and put grease
Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD - Image 2

Details & Craftsmanship

Every detail has been carefully considered to bring you the perfect product.

Description

SPECIFICATIONS
Features
  • Diamond Scriber for cutting the thin single crystal substrate such as Silicon, Sapphire, Ge, LiNbO3, and LiTaO3 Wafer
  • The cutting pressure is adjustable by the spring
  • Cutting size:   
    • 100 x100 mm (4 x 4")
    • 200 x200 mm (8 x 8'')
    • 300 x300 mm (12 x 12'')
    • Max. The cutting thickness for single-crystal substrate: 1 mm
  • Made in Japan
Cutting Procedure
  • Adjust the height of the diamond scriber
  • Tuning the pressure of the spring
  • Placing the substrate
  • Scribing
  • Splitting the substrate
Replace Diamond Scriber
  • Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the original point of 0
  • Move the slide unit to the diamond scriber replacement position and remove the guide rod
  • Turn the handle over 90 degrees to the left
  • Loosen the screw by using the hex wrench and remove the diamond scriber
  • Install the new diamond scriber and tighten the screw
  • Return the handle to the scribing position and set the guide rod
Product Dimensions
  •  SYJ-DS100: 210 mm (L) x 210 mm (W) x 140 mm (H)  
  •     SYJ-DS200: 310 mm (L) x 310 mm (W) x 140 mm (H)
  •     SYJ-DS300: 410 mm (L) x 410 mm (W) x 140 mm (H)
Diamond cutting knife
  • One diamond knife is included with a dimension 13 mm (L) x 26 mm (W) x 5 mm (H)
  • Please click the picture let to order a replacement
The thickness of the Cutting Wheel
  • 0.65mm
Compliance
  • No UL is required because no electric
Warranty
  • One-year limited warranty with lifetime support
Operational video
  •   
Application Notes
  • The minimum size of the substrate is at least twice the thickness. Generally, it is 5 mm x 5 mm.
  • Replace the diamond scriber when dull
  • To avoid the spring being degraded, turn the spring pressure dial to the initial position of 0 after use
  • For long-term use, wipe the slitting unit guide rod periodically and put grease