Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2
HomeStore

Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2

Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2

$9,799.30

Original: $27,998.00

-65%
Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2—

$27,998.00

$9,799.30

The Story

The VHP-5000N2 is a Compact Vacuum Hot Flat Press for wafer welding or film transfer. The maximum sample size is 50mm x 50mm x 15mm. The superior performance of the equipment is very suited for sintered bonding research of third-generation semiconductor devices. The maximum operating temperature is 500 ° C and the maximum pressure is 5000N. It is fully satisfied with the need for packaging interconnection materials in the process of semiconductor preparation. The vacuum and atmosphere environment provided by it can reduce the oxidation of materials as much as possible. It is a very cost-effective laboratory R & D equipment.

Specifications

Power
  • 110V or 208V selectable, single phase, 50/60 Hz
  • 250W

Heating Plates
  • Both heating plates are made of heat-resistant stainless steel and built inside the vacuum chamber
  • Heating Plates: 50mm X 50mm
  • Max Temperature: 500 (<30min)
  • Continuous Working Temperature: 450
  • Heating Rate: 10/min
  • Flatness(Cold) ≤0.005mm
  • Max Sample Size: 50mm * 50mm * 15mm
  • Heat Power: 200W

Temp. Controller 
  • Two Precision digital temperature controllers independently control up and bottom heating plates
  • Maximum of 30 programmable segments to control heating, dwelling, and cooling
  • Temperature accuracy: ± 1ºC, ± 3ºC at 500

Pressing System
  • Max Pressure: 500Kg/5000N at 500
  • Dual Mode(manual/auto) Electric Oil-Free Press (30mm stroke)
  • Constant Pressure Accuracy(Auto Mode): ±1Kg(±10N)
  • Constant Pressure Duration: 1-9999 Minutes
  • Pressure Display Range: 1-500Kg
  • Pressure Control Range: 1-500Kg [10-1000N]
Vacuum Chamber
  • Made of 304 stainless steel with stiffener welded to prevent deformation
  • Vacuum: <5*10E-2 torr (cold, 30 mins pumping with FYP-Pump
  • Mechanical Pressure Gauge: -0.1-0.15MPa
  • 4-inch Observation Window
  • KF25 Port and KF16 Port for vacuum pump
  • KF50 Port for heating wiring and thermocouple wiring
(Optional)
Chilled Water and Vacuum Generation

(Required but not included)
  • KJ5000 Digital Recirculating Water Chiller is required (16L / min Flow, 2.8K BTU/hr)
  • FYP-Pump NRTL Certified 156 L/min Double Stage Rotary Pump is optional ( 10-2 torr )
  • PV-HVS-LD turbo pump is optional 10- 5 torr
  •    

Warning
  • Dust free environment is recommended
  • The press will auto reset to its lowest position on start-up, BEWARE
  • Scald and Burn Risk, ALWAYS wear protective gear not limited to gloves and goggles
  • Gas cylinder pressure is highly recommended ≤ 0.2MPa.  

 

Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2 - Image 2

Details & Craftsmanship

Every detail has been carefully considered to bring you the perfect product.

Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2 - Image 3

Details & Craftsmanship

Every detail has been carefully considered to bring you the perfect product.

Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2 - Image 4

Details & Craftsmanship

Every detail has been carefully considered to bring you the perfect product.

Description

The VHP-5000N2 is a Compact Vacuum Hot Flat Press for wafer welding or film transfer. The maximum sample size is 50mm x 50mm x 15mm. The superior performance of the equipment is very suited for sintered bonding research of third-generation semiconductor devices. The maximum operating temperature is 500 ° C and the maximum pressure is 5000N. It is fully satisfied with the need for packaging interconnection materials in the process of semiconductor preparation. The vacuum and atmosphere environment provided by it can reduce the oxidation of materials as much as possible. It is a very cost-effective laboratory R & D equipment.

Specifications

Power
  • 110V or 208V selectable, single phase, 50/60 Hz
  • 250W

Heating Plates
  • Both heating plates are made of heat-resistant stainless steel and built inside the vacuum chamber
  • Heating Plates: 50mm X 50mm
  • Max Temperature: 500 (<30min)
  • Continuous Working Temperature: 450
  • Heating Rate: 10/min
  • Flatness(Cold) ≤0.005mm
  • Max Sample Size: 50mm * 50mm * 15mm
  • Heat Power: 200W

Temp. Controller 
  • Two Precision digital temperature controllers independently control up and bottom heating plates
  • Maximum of 30 programmable segments to control heating, dwelling, and cooling
  • Temperature accuracy: ± 1ºC, ± 3ºC at 500

Pressing System
  • Max Pressure: 500Kg/5000N at 500
  • Dual Mode(manual/auto) Electric Oil-Free Press (30mm stroke)
  • Constant Pressure Accuracy(Auto Mode): ±1Kg(±10N)
  • Constant Pressure Duration: 1-9999 Minutes
  • Pressure Display Range: 1-500Kg
  • Pressure Control Range: 1-500Kg [10-1000N]
Vacuum Chamber
  • Made of 304 stainless steel with stiffener welded to prevent deformation
  • Vacuum: <5*10E-2 torr (cold, 30 mins pumping with FYP-Pump
  • Mechanical Pressure Gauge: -0.1-0.15MPa
  • 4-inch Observation Window
  • KF25 Port and KF16 Port for vacuum pump
  • KF50 Port for heating wiring and thermocouple wiring
(Optional)
Chilled Water and Vacuum Generation

(Required but not included)
  • KJ5000 Digital Recirculating Water Chiller is required (16L / min Flow, 2.8K BTU/hr)
  • FYP-Pump NRTL Certified 156 L/min Double Stage Rotary Pump is optional ( 10-2 torr )
  • PV-HVS-LD turbo pump is optional 10- 5 torr
  •    

Warning
  • Dust free environment is recommended
  • The press will auto reset to its lowest position on start-up, BEWARE
  • Scald and Burn Risk, ALWAYS wear protective gear not limited to gloves and goggles
  • Gas cylinder pressure is highly recommended ≤ 0.2MPa.