LaF3 6.35 mm Dia. x 1.575mm ,fine ground
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LaF3 6.35 mm Dia. x 1.575mm ,fine ground

LaF3 6.35 mm Dia. x 1.575mm ,fine ground

$125.65

Original: $359.00

-65%
LaF3 6.35 mm Dia. x 1.575mm ,fine ground—

$359.00

$125.65

The Story

Substrate Specifications

  • Size:            6.35 mm Dia. x 1.575mm
  • Orientation:  (100) +/-1.5 Deg
  • Polish:          fine ground  , by CMP technology with less sub-surface lattice damage.
  •  
  • Pack:           Packed in 100 grade plastic bag under 1000 class clean room.

 

 Typical Specifications

Crystal Structure

Trigonal:  a= b= 7.190 A,  c=7.367 A,  alpha=beta  =90o,  gama =120o

Growth Method

Bridgman

Melting Point

1493  oC

Crystal Purity

> 99.9%

Crystal Growth Direction

< 0001 >

Density

5.936  g/cm3

Hardness

4.5 (Mohs)

Thermal Expansion

 11.9  x10-6/ K // c       15.8  x10-6/ K // a  

Thermal Conductivity

5.1   W / m.k @ 300K

Optical Transmission Range

 Up to 10.5 micron wavelength

ho : 1.63      he: 1.597

Orientation

<0001>  +/- 0.5o

Standard Boule

 10 ~ 50 mm diameter


Related Product

Other Crystal wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

Film Coater

Description

Substrate Specifications

  • Size:            6.35 mm Dia. x 1.575mm
  • Orientation:  (100) +/-1.5 Deg
  • Polish:          fine ground  , by CMP technology with less sub-surface lattice damage.
  •  
  • Pack:           Packed in 100 grade plastic bag under 1000 class clean room.

 

 Typical Specifications

Crystal Structure

Trigonal:  a= b= 7.190 A,  c=7.367 A,  alpha=beta  =90o,  gama =120o

Growth Method

Bridgman

Melting Point

1493  oC

Crystal Purity

> 99.9%

Crystal Growth Direction

< 0001 >

Density

5.936  g/cm3

Hardness

4.5 (Mohs)

Thermal Expansion

 11.9  x10-6/ K // c       15.8  x10-6/ K // a  

Thermal Conductivity

5.1   W / m.k @ 300K

Optical Transmission Range

 Up to 10.5 micron wavelength

ho : 1.63      he: 1.597

Orientation

<0001>  +/- 0.5o

Standard Boule

 10 ~ 50 mm diameter


Related Product

Other Crystal wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

Film Coater

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