DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD
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DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD

DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD

$44,094.75

Original: $125,985.00

-65%
DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD—

$125,985.00

$44,094.75

The Story

The VTC-600GD-4HD High Vacuum Magnetron Sputtering System coating device designed for the deposition of single-layer films. It can be configured with up to four sputtering targets, and also can be equipped with an RF power supply for sputtering non-conductive target materials, or a DC power supply for sputtering conductive materials. It offers broader application capabilities, small footprint as well as a compact and user-friendly design, making it an ideal tool for laboratory thin film deposition. It is especially suitable for research on solid-state electrolytes, OLEDs, and other advanced materials. 3 RF heads model is available.

Highlights:

  • Modular System Design: The system adopts a modular structure with separate vacuum chamber, pumping unit, and control power supplies, allowing flexible configuration based on user requirements.

  • Flexible Power Configuration: Users can choose from various power supply setups—one power supply can control multiple sputtering targets, or each target can be independently controlled by a dedicated power supply.

SPECIFICATIONS

Power Requirements
  • 208–240 VAC, Single Phase, 50/60 Hz
Total Power Consumption
  • < 3.5 kW
Source Power
  • DC Source: 500W power for coating metallic materials 
  • RF Source: 300W power, 13.56 MHz frequency for coating non-conductive materials

Magnetron Sputtering Head
  • Four 2" Magnetron Sputtering Heads with water cooling jackets and shutters
    • One is connected to a DC source for metallic materials
    • The other is connected to the RF source for non-conductive materials
    • Target size: 2" diameter with a thickness of 0.1 - 5 mm
    • Sputtering targets are optional
    • Recommended Sputtering Recipe and Useful Tips

  • Extra 148 cm RF cable can be ordered at extra cost for the replacement
  •  




Vacuum Chamber
  • Stainless Steel Semicircular Vacuum Chamber: Ø300
  • Hinged type top flange for easy sample access
  • Here is a glance of the vacuum chamber
  • Ultimate Vacuum: 3.0 × 10⁻⁵ Pa (2.25 × 10⁻⁷ Torr)



Sample Stage
  • Ø140 mm rotating and heating sample stage up to 500°C 
  • Rotation speed: 1 - 20 rpm

Gas Flow Control
  • Two mass flow controllers (MFC)
    • Flow rate: 0 – 200 sccm
    • nitrogen calibrated
  • 1/4" vent port.

Vacuum Pump Station

(Optional)
  • For air-sensitive targets, such as Al, Ti, Cr, etc, or base pressure <1e-2 torr, a pumping station is recommended
  • Turbo pump .
    • 63 L/s turbomolecular pump, or
    • 260 L/s turbomolecular pump
  • Backing pump
    • 240 L/min rotary vane pump, or
    • 200 L/min dry scroll pump

Water Chiller

(Optional)
  • Chilled water is required
  • One digital temperature-controlled recirculating water chiller is recommended
    • Refrigeration range: 5~35 °C
    • Flow rate: 16 L/min
    • Pump pressure: 14 psi
Film Thickness Measurement
(Optional )
  • Quartz crystal microbalance for in-situ film thickness measurement is optional. Accuracy up to 1Å

 Application Notes
  • Please use 5N purity Argon gas for plasma sputtering. 
  • For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
  • MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order) 
  • MTI Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
  • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
  • DO NOT use DI water in a water chiller. Use distilled water
  • The coater can be placed into glovebox as the Pic. 6 at extra cost ( must order glovebox together)
  •  Pic 3
     Pic 5
    Pic. 6
DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD - Image 2

Details & Craftsmanship

Every detail has been carefully considered to bring you the perfect product.

DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD - Image 3

Details & Craftsmanship

Every detail has been carefully considered to bring you the perfect product.

DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD - Image 4

Details & Craftsmanship

Every detail has been carefully considered to bring you the perfect product.

Description

The VTC-600GD-4HD High Vacuum Magnetron Sputtering System coating device designed for the deposition of single-layer films. It can be configured with up to four sputtering targets, and also can be equipped with an RF power supply for sputtering non-conductive target materials, or a DC power supply for sputtering conductive materials. It offers broader application capabilities, small footprint as well as a compact and user-friendly design, making it an ideal tool for laboratory thin film deposition. It is especially suitable for research on solid-state electrolytes, OLEDs, and other advanced materials. 3 RF heads model is available.

Highlights:

  • Modular System Design: The system adopts a modular structure with separate vacuum chamber, pumping unit, and control power supplies, allowing flexible configuration based on user requirements.

  • Flexible Power Configuration: Users can choose from various power supply setups—one power supply can control multiple sputtering targets, or each target can be independently controlled by a dedicated power supply.

SPECIFICATIONS

Power Requirements
  • 208–240 VAC, Single Phase, 50/60 Hz
Total Power Consumption
  • < 3.5 kW
Source Power
  • DC Source: 500W power for coating metallic materials 
  • RF Source: 300W power, 13.56 MHz frequency for coating non-conductive materials

Magnetron Sputtering Head
  • Four 2" Magnetron Sputtering Heads with water cooling jackets and shutters
    • One is connected to a DC source for metallic materials
    • The other is connected to the RF source for non-conductive materials
    • Target size: 2" diameter with a thickness of 0.1 - 5 mm
    • Sputtering targets are optional
    • Recommended Sputtering Recipe and Useful Tips

  • Extra 148 cm RF cable can be ordered at extra cost for the replacement
  •  




Vacuum Chamber
  • Stainless Steel Semicircular Vacuum Chamber: Ø300
  • Hinged type top flange for easy sample access
  • Here is a glance of the vacuum chamber
  • Ultimate Vacuum: 3.0 × 10⁻⁵ Pa (2.25 × 10⁻⁷ Torr)



Sample Stage
  • Ø140 mm rotating and heating sample stage up to 500°C 
  • Rotation speed: 1 - 20 rpm

Gas Flow Control
  • Two mass flow controllers (MFC)
    • Flow rate: 0 – 200 sccm
    • nitrogen calibrated
  • 1/4" vent port.

Vacuum Pump Station

(Optional)
  • For air-sensitive targets, such as Al, Ti, Cr, etc, or base pressure <1e-2 torr, a pumping station is recommended
  • Turbo pump .
    • 63 L/s turbomolecular pump, or
    • 260 L/s turbomolecular pump
  • Backing pump
    • 240 L/min rotary vane pump, or
    • 200 L/min dry scroll pump

Water Chiller

(Optional)
  • Chilled water is required
  • One digital temperature-controlled recirculating water chiller is recommended
    • Refrigeration range: 5~35 °C
    • Flow rate: 16 L/min
    • Pump pressure: 14 psi
Film Thickness Measurement
(Optional )
  • Quartz crystal microbalance for in-situ film thickness measurement is optional. Accuracy up to 1Å

 Application Notes
  • Please use 5N purity Argon gas for plasma sputtering. 
  • For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
  • MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order) 
  • MTI Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
  • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
  • DO NOT use DI water in a water chiller. Use distilled water
  • The coater can be placed into glovebox as the Pic. 6 at extra cost ( must order glovebox together)
  •  Pic 3
     Pic 5
    Pic. 6

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